Surface-Mount Technology (SMT)

We offer a high quality electronic board assembly service, suitable for both industrial and space applications. We are guided by IPC standards, from industrial standards IPC-A-610 and IPC-J-STD-001 to the most stringent space requirements.

We have automated SMT technology and manual soldering technology for both surface mount and insertion, which allows us to adapt to various assembly needs. Each plate is inspected and validated to ensure durability and reliability, meeting the most demanding customer and regulatory requirements.

With high quality automated SMT (Surface-Mount Technology), we have the capacity to assemble electronic boards, adapted to the specifications of each customer and ensuring maximum durability and reliability. We use advanced machinery to achieve maximum precision and reliability in each project.

EQUIPMENT

JUKI G TITAN

Equipped with automatic paste dispensing system for uniform and precise application.

PCB SIZE
Min. 50mm x 50mm
Max. 510mm x 510 mm
ADJUSTABLE INSOLE
FRAME SIZE
Min. 470x370mm
Max. 737x737mm
PUNE HEIGHT
0.4mm to 6mm.

JUKI RS-1R

Capable of placing up to 50,000 components per hour, equipped with an adaptable 8-nozzle placement head, allowing fast and accurate assembly of various components.

One LNC-120 multi-nozzle 3D laser alignment system with eight nozzles
PUNE HEIGHT
1mm, 6mm, 12mm, 20mm, 25mm
PCB SIZE
370mm W x 650mm L (Max)

VAC745

Vapor-phase soldering machine with a specialized vacuum system to remove porosities from the solder. This system significantly improves reliability by eliminating air bubbles and ensuring homogeneous heat distribution, ideal for sensitive components and complex assemblies.

PCB SIZE
600 x 500 mm
DOBLE LAYER
Leaded and lead-free soldering capability

Manual welding and aerospace quality inspections

Capabilities

Inspections

REFERENCE STANDARDS

SERVICES BROCHURE

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