Qualification Services for Components, Processes, and Materials
VENG’s laboratory offers specialized services for the characterization of Electronic, Electrical, and Electromechanical (EEE) components, focusing on ensuring high reliability essential for space applications and other demanding environments. These services assess and validate the performance, reliability, and robustness of components under various conditions through a series of electrical, mechanical, and environmental tests.
Process Engineering
The engineering team collaborates closely in planning and managing each phase of the qualification and verification procedures, ensuring precise characterization and maintaining complete traceability throughout the process.
Characterization of EEE Components
- Environmental Tests: These include thermal cycling and hermeticity tests. Thermal tests simulate extreme temperature conditions to ensure components maintain functionality in critical environments, while hermeticity tests ensure the internal cavities of components remain free from moisture.
- Mechanical Tests: Aimed at verifying the robustness of components under extreme physical conditions, these tests include microsectioning, pull and shear tests, vibration tests, hardness measurements, optical microscopy, scanning electron microscopy (SEM), and acoustic microscopy (SAM).
- Electrical Tests: These evaluate operational parameters such as current, voltage, resistance, and other key electrical values to ensure optimal and reliable performance.
Environmental Testing Capabilities
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FINE AND GROSS HERMETICITY |
Conducted per MIL-STD-883, Method 1014, Conditions A1, A2, C1, and E; MIL-STD-750, TM 1071, Conditions D, J, H1, and H2 MIL-STD-202, TM112, Conditions C, Procedure IIIa, IIIC, and Condition E. |
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THERMAL CYCLING |
Performed according to MIL-STD-883, Method 1010.9 |
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BURN-IN TEST |
Executed following MIL-STD-883, Method 1015.12 |
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THERMAL SHOCK |
Conducted as per MIL-STD-883, Method 1011.9 |
Mechanical Testing Capabilities
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BOND STRENGTH |
MIL-STD-883, Method 2011 |
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MIL-STD-750, Method 2037 |
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DIE SHEAR |
MIL-STD-883, Method 2019 |
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MIL-STD-750, Method 2017 |
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LEAD INTEGRITY |
MIL-STD-883, Method 2004 |
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CONSTANT ACCELERATION |
MIL-STD-750 Method 2001 |
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DIMENSIONAL VERIFICATION |
MIL-STD-883, Method 2016 |
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PIND |
MIL-STD-883, Method 2020. |
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MIL-STD-202, Method 217 |
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OPTICAL MICROSCOPY |
Includes external visual inspection |
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SCANNING ACOUSTIC MICROSCOPY (SAM) |
MIL STD 883 , Die Attached |
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SCANNING ELECTRON MICROSCOPY (SEM) |
MIL-STD-883, Method 2018.6 |
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MIL-STD-750, Method 2077.5 |
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X-RAY FLUORESCENCE (XRF) |
MIL-STD-883, Method 2037 |
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CROSS-SECTIONING |
MIL-STD-1580 |
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RADIOGRAPHY |
MIL STD 883 Method 2012.11 |
Electrical Testing Capabilities
3001.1 Drive source, dynamic
3002.1 Load conditions
3003.1 Delay measurements
3004.1 Transition time measurements
3011.1 Output short circuit current
4001.1 Input offset voltage and current and bias current
4007 Automatic gain control range
301 Dielectric withstanding voltage
302 Insulation resistance
303 DC resistance
304 Resistance temperature characteristic
305 Capacitance
306 Quality factor (Q)
Relifing Process of Components
Visual Inspection
Optical microscopy analysis to detect defects.
Electrical Testing
Electrical measurements performed according to the component family
Hermeticity – Fine Leak Method
Aimed at detecting fine leaks in hermetically sealed electronic components.
Hermeticity – Gross Leak Method
Identification of gross leaks in hermetically sealed electronic components.
Decapsulation of Electronic Components
Decapsulation is the process of removing or opening the protective casing of an electronic component to access its internal structure. This procedure is performed for failure analysis, reverse engineering, quality assurance, or academic research.
Decapsulation Methods
- Mechanical: Abrasive tools are used to remove the encapsulating material.
- Chemical: Acids are used to break down the encapsulating material.
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CHEMICAL DECAPSULATION |
MIL-STD-1580 |
Equipment: NISEN JET PRO Decapsulation using nitric and sulfuric acid, with controlled time, pressure, and temperature. |
Verification Process for BGA and CCGA Chip Soldering
External Visual Inspection
Performed by a trained operator using an OPTILIA XL Microscope. SMT solder joints.
X-ray Inspection
Conducted by a specialized operator using a GE Nanomex 180x X-ray machine.
Vibration and Thermal Cycling
Performed by certified operators using the LDS V875 shaker.
Sample Preparation
Performed by a specialized technician using BUEHLER equipment.
Metallographic Inspection
Conducted by a senior analyst using optical and scanning electron microscopy (SEM).
Solder Joint Reliability Analysis
Solderability Assessment
Includes pre-process inspections: visual inspection, X-ray, thermal cycling, vibration, and microsection analysis.
Reliability Testing
Thermal cycling with resistance monitoring of solder joints, to determine the number of cycles at which joint fracture occurs.
PCB Qualification and Acceptance Process
Visual Inspection
Standard optical microscopy following IPC-A-600 acceptance criteria.
Dimensional Verification
Performed with coordinate-based optical MMC system.
Electrical Testing
Impedance, insulation, and continuity measurements. Includes high-voltage tests.
Material Characterization
X-ray fluorescence for material identification.
Thickness measurement using eddy current technology.
Structural Integrity
Microsectioning and microscopic inspection according to standard requirements.
